02701 國民技術
NSING TECH
NSING TECH
| Register Close | 2026/03/18 IPO Closing in 4 Days |
| Listing Date | 2026/03/23 |
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IPO Detail
COMPANY PROFILE
Nsing Technologies Inc. is a platform-based integrated circuit (“IC”) design company, and focus on delivering control chips and system solutions for a broad range of intelligent terminals, it has also operated a lithium-ion battery anode material business. The Group has established diversified product offerings that are widely adopted across key sectors such as consumer electronics, industrial control and digital energy, smart home, automotive electronics, and medical electronics.
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According to the report, in terms of revenue in 2024, the Group ranked as the fifth largest Chinese companies in the global platform-based microcontroller unit (“MCU”) market, and the third largest Chinese companies in the global 32-bit platform-based MCU market, and ranked first in China’s MCU market with embedded commercial cryptographic algorithm module.
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The Group offer a wide variety of MCUs (including general-purpose MCUs, specialized market chips and RF chips) and BMS chips under its chip products business line, and artificial graphite products and graphitization processing services under its lithium-ion battery anode material products business line.
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The Group’s customers primarily include companies principally engaged in distribution and production of electronic components, semiconductors and modular circuits as well as lithium-ion battery plants. The Group generated its revenue primarily from sales of chip products, and sales of lithium-ion battery anode material products and graphitization processing services.
BASIC INFORMATION
| Market | Hong Kong (Main Board) |
| Business Nature | IT Hardware |
| Major Business Area | China |
| Board Lot | 200 |
GLOBAL OFFERING
| No. of Offer Shares | 95.00M H shares |
| No. of International Offer Shares | 85.50M H shares |
| No. of HK Offer Shares | 9.50M H shares |
| Offer Price | $10.80 |
| Stock Code | 2701 |
| Sponsor(s) | CITIC Securities (Hong Kong) Limited |
| Underwriter(s) | CLSA Limited, BOCOM International Securities Limited, SPDB International Capital Limited, Jinluo Securities Limited, Futu Securities International (Hong Kong) Limited |
TIME TABLE
| Application Period | Mar 13 (Fri) - noon, Mar 18 (Wed) |
| Price Determination Date | Mar 19 (Thu) |
| Result Announcement Date | On or before Mar 20 (Fri) |
| Result Announcement Date | On or before Mar 20 (Fri) |
| Result Announcement Date | On or before Mar 23 (Mon) |
| Dealings in Shares commence on | Mar 23, 2026. (Mon) |
Reallocation of Shares Offered
Sales Statistics (HKD)
| Offer Price | $10.80 |
| Capitalization (H Shares) | 1.03B |
| NAV / share ($) | $2.57 (Unaudited pro forma adj NAV / share) |
Use Of Proceeds
| Assuming the offer price being at HKD 10.8, the net proceeds raised would be HKD 943.90M, of which |
| 50.8% : Enhance research and development capabilities, develop new product lines including high-performance MCUs, multi-protocol communication chips, specialized market chips and automotive-grade chips among others |
| 9.2% : Upgrade existing product portfolio |
| 15% : Conduct strategic investments and acquisitions |
| 15% : Repay part of outstanding bank loans |
| 10% : Working capital |
Related Document
| Prospectus |  Chinese Version | English Version |
| Remark： | The above information is referenced from the prospectus. |
| All data is calculated from the non- exercise rights(if applicable). |
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*Admission fees include brokerage of 1%, SFC transaction levy of 0.0027%, Stock Exchange trading fee of 0.005% and FRC transaction levy of 0.00015% (i.e. 1.0077% in total).